A New Stability Test for Passivated NiCr Thin Film Resistors

Improved stability of thin-film resistors

Earlier, deeper investigations into the drift behavior of thin-film resistors have shown that the usual methods for predicting drift are incapable of describing the present remarkable differences within a certain R-layer alloy system (for example, CrNi) or those between different alloy systems (for example, CrNi versus CrSi or TaN). In order to come to a more precise model, we have to ignore al...

Frequency Response of Thin Film Chip Resistors

High frequency measurements from 0.1 GHz to 40 GHz were performed on industry standard flip chip thin film resistors from Vishay Thin Film. The results of these measurements are reported in this paper. A lumped circuit model is presented that accurately predicts the response of various part values and case sizes. The results of the measurements and model are combined to demonstrate basic design...

Developments of the Physical and Electrical Properties of NiCr and NiCrSi Single-Layer and Bi-Layer Nano-Scale Thin-Film Resistors

In this study, commercial-grade NiCr (80 wt % Ni, 20 wt % Cr) and NiCrSi (55 wt % Ni, 40 wt % Cr, 5 wt % Si) were used as targets and the sputtering method was used to deposit NiCr and NiCrSi thin films on Al₂O₃ and Si substrates at room temperature under different deposition time. X-ray diffraction patterns showed that the NiCr and NiCrSi thin films were amorphous phase, and the field-effect s...

Stability of Steady States for Thin Film

Preliminary assessment of the stability of thin- and polymer thick-film resistors embedded into printed wiring boards

0026-2714/$ see front matter 2012 Elsevier Ltd. A http://dx.doi.org/10.1016/j.microrel.2012.03.026 ⇑ Corresponding author. E-mail address: [email protected] (W Embedding passive components into multilayer printed wiring boards (PWBs) meet electronic device requirements concerning the necessity of saving the surface board area for active elements, reducing board’s size, improving de...